Get a Quick Online Quote: Register or Login

Micro Circuits – HDI PCB

What Are HDI PCB Micro Circuits?

A high density interconnector printed circuit board (HDI PCB) is a circuit board that has a higher wiring density per unit area as opposed to conventional circuit boards. This allows for more components to fit in the total available space. HDI PCBs are useful for increasing electrical performance while reducing the weight and size of equipment.

HDI PCBs have minor vias, capture pads, finer spaces and lines, and higher connection pad density making them a better option for boards where space is a concern. HDI technology is regularly used in products like mobile phones, personal computers, MP3 players, game consoles, and more.

Micro Circuits – HDI PCB



Micro Circuits from San Francisco Circuits have some of the most advanced capabilities in one of the fastest growing and most-requested PCB technology market, HDI printed circuit boards.

SFC’s capabilities allows you to easily overcome the limitations found in standard circuit technologies through the utilization of ultra-thin cores, fine line processing and alternative via methods to reduce the size and weight of your components while simultaneously enhancing performance.


Get your PCBs Built-Fast.

Contact us for a PCB quote
or call us at 1-800-SFC-5143

The HDI PCBs we offer include the following highly requested characteristics:

  • Blind and/or buried vias
  • Via-in-pad
  • Through vias from surface to surface
  • 20 µm circuit geometries
  • 30 µm dielectric layers
  • 50 µm laser vias
  • 125 µm bump pitch processing

Our high density circuit boards have the technology-pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.

Call us at 800.SFC.5143 or get an instant PCB quote.

Multi Chip Module - HDI PCB

Multi Chip Module

High Density PCB Wirebond Array

High Density Wirebond Array

Fine Line PCB

8 Layer Flip Chip - HDI PCB

8 Layer Flip Chip

Benefits of HDI PCB Technology with Micro Circuits:

  • Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices.
  • Allows utilization of technologies that require ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer in the case of a thermal PCB.
  • Allows utilization of the technologies that require 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.
  • Allows reducing the “time to market” equation by combining the process capabilities with a strong comprehension of high speed digital and high frequency RF PCB package requirements.
  • Increases the area for the PCB designer provider to place circuit components as the components are decreased in size and spaced much closer together. This also improves faster signal transmission and reduced signal loss.


  • High Tg, BT resins
  • Low Dk, Low Df Formulations
  • High Strength, Low CTE selections
  • Polyimide/Kapton
  • Multi-function FR-4
  • Min Cladding ? oz
  • Max Cladding 2 oz
  • Min Thickness .03mm (.0012)


  • Controlled Dielectrics Thicknesses
  • Controlled Impedance (2% tolerance)
  • Differential Signals
  • Microstrip and stripline
  • Build Ups (to 12 Layers)
  • Blind Vias, Buried Vias
  • Flex .025mm (.001)
  • Conductive Hole Plug
  • "Via in Pad" for RF and High Density substrates
  • Additive and Subtrative Processes


  • Mechanical, Laser and Plasma
  • Min drill hole .025mm (.001)


  • Wirebondable Structures
  • Differential Metalizations
  • Electrolytic/Electroless Plating
  • Full Body, Selective and Contact Gold
  • Immersion Silver


  • Min Line .020mm (.0008)
  • Min Space .020mm (.0008)
  • Finish Trace Tolerances +/-
    •  ¼ oz Int 5%
    •  1 oz Int 15%


  • Per IPC-SM-840
  • Taiyo and Conventional Epoxies
  • Liquid Photo-Imageable and Dry Films
  • "Flex" Mask


  • Complete COC’s
  • Cross Section Analysis
  • Bondability assurance (pull strength and sigma analysis)
  • XRF Analysis
  • NIST Certified


  • Gerber RS274X
  • DXF, DWG
  • AutoCAD


  • Valor Genesis 2000


  • High Density Flying Probes
  • Net List Comparison
  • AOI


  • OFHC Copper or 6061-T6 Aluminum
  • Conductive adhesives with precision tolerances
  • Cavity Fabrications


  • Thermal Stress/Cross Sections
  • Dielectric Spacing Verification
  • Plating Process Controls

We also specialize in flexible HDI PCBs which you can read more about on our flex PCB page and PCB assembly.

Thru Layer Visualization - HDI Circuit

Thru Layer Visualization


Call us: 1-800-SFC-5143

Our experts are available 24/7 to consult you for your project

San Francisco Circuits, Inc.

1660 S Amphlett Blvd #200
San Mateo,CA 94402
Toll-Free: (800)732-5143

 NIST LogoITAR Compliance Seal  IPC International, Inc. Membership Seal SAM

San Francisco Circuits - San Diego

3914 Murphy Canyon Rd., Suite A244
San Diego, CA 92123
Local: (858)576-7202

Follow us

Twitter Logo Facebook Logo LinkedIn Logo

©Copyright 2005 - 2024 - San Francisco Circuits, Inc. - All rights reserved

Latest News


PCB Line Spacing: A Comprehensive Breakdown for High Voltage Applications. As PCBs become more complicated, more precise measurements and spacing are required. This article explains PCB line spacing, tracing, clearance, and creepage.

Read more


Via tenting is the application of soldermask to encase or seal the via’s opening. A via is essentially a hole drilled into the PCB that facilitates connections between multiple PCB layers. An untented via, on the other hand, remains uncovered by a soldermask layer. The decision to expose or cover these vias carries both advantages and disadvantages contingent upon your specific design and manufacturing requirements.

Read more

User Login