Burn-in Boards
Burn-in is a process done to components prior to regular use in which the components are stressed to detect failure and ensure component reliability.
The PCB burn-in process is usually done at 125ºC, with electrical excitation applied to the samples. The burn-in process is facilitated by using burn-in boards where the samples are loaded. These burn-in boards are then inserted into the burn-in oven which supplies the necessary voltages to the samples while maintaining the oven temperature at 125ºC. The electrical bias applied may either be static or dynamic.
Through our strong network with the best PCB Manufacturers in the United States and over-seas, San Francisco Circuits offers the most reliable Burn-in Printed Circuits Boards.
There are no limitations on BIB order quantity or lead time with San Francisco Circuits on a burn-in PCB fabrication order.
Call us at 650.655.7202 or get a PCB quote with us online for your burn-in PCB fab needs.
Specifications
|
Standard Technology
|
Advanced Technology
|
|
Number of Layers
|
1 - 18
|
20 - 30
|
|
Board Material
|
370HR
BT
Polymide
Nelco 4000-13
|
370HR
BT
Polymide
Nelco 4000-13
|
|
Board Thickness
|
0.062'' - 0.125''
|
0.125'' - 0.250''
|
|
Board Size
|
Smaller then 12''x24''
12'' x 24''
19'' x 23''
|
23" x 27"
|
|
Hole Aspect Ratio
|
12 : 1
|
15 : 1
|
|
Minimum
Hole Size
|
0.006''
|
0.005''
|
|
Controlled Impedance
Tolerance
|
+/- 10%
|
+/- 5%
|
|
Minimum Trace/Space
|
0.004"
|
0.003"
|
|
Minimum SMD Pitch
|
0.006"/0.006"
|
0.003"/0.003"
|
|
Final Finish
|
ENIG
HASL
Hard Gold
Tin-Nickel
|
Hard-Gold
ENIG
Tin-Nickel
|
| 
